Selsil Adhesive Foam packaging

Adhesive Foam

Selsil Adhesive Foam is a single-component, polyurethane-based bonding foam that cures with atmospheric moisture. It is used to bond polystyrene insulation boards, including XPS and EPS, in building thermal-insulation systems. It is also suitable for bonding decorative building elements such as mouldings.

  • It provides excellent adhesion to many building materials.
  • It can be cut and painted after curing.
  • Easy to apply.
  • It does not clog during short pauses in application.
  • Contains no CFC or HCFC gases.

Technical Specifications

Chemical Composition — ResultPolyurethane
Curing Mechanism — ResultAtmospheric moisture
Colour — ResultLight Pink
Application Temperature — Result+5 °C - +35 °C
Temperature Resistance (Cured) — Result-30 °C - +80 °C
Fire Resistance — ResultB3
Density — Result18 ± 3 kg/m³
Density — MethodSEL DM 135
Metric Yield (845 g) — Result9.48 m @ 3x10 cm 17.78 m @ 4x4 cm 31.60 m @ 3x3 cm
Metric Yield (845 g) — MethodSEL DM 135
Yield (850 g) — Result40–50 L
Yield (850 g) — MethodSEL DM 59
Free-Rise Density — Result25 ± 3 kg/m³
Free-Rise Density — MethodSEL DM 31
Dimensional Stability — Result<5%
Dimensional Stability — MethodSEL DM 60
Expansion — Result70–85%
Expansion — MethodSEL DM 128
Cutting Time — Result25–30 min
Cutting Time — MethodSEL DM 35
Tack-Free Time — Result5–7 min
Tack-Free Time — MethodSEL DM 61
Sagging — ResultNo sagging @ 5 cm joint
Sagging — MethodSEL DM 37
Compressive Strength — Result83.13 kPa
Compressive Strength — MethodSEL DM 111
Tensile Strength — Result57.53 kPa
Tensile Strength — MethodSEL DM 110
Shear Strength — Result6.68 MPa
Shear Strength — MethodSEL DM 113
Adhesion Strength — Result83.13 kPa
Adhesion Strength — MethodSEL DM 141
Thermal Conductivity — Result0.0285 W/m.K
Thermal Conductivity — MethodTS EN 12667
VOC — ResultFrench VOC and CMR regulation

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